KEY FEATURES
- SMBB TechnologyBetter light trapping and current collection to improve module power output and reliability
- PID ResistanceExcellent Anti-PID performance guarantee viaoptimized mass-production process and materials control.
- Higher Power OutputModule power increases 5-25% generally,bringing significantly lower LCOE and higher IRR
- Hot 2.0 TechnologyThe N-type module with Hot 2.0 technology has better reliability and lower LID/LETID
- Enhanced Mechanical LoadCertified to withstand: wind load (2400 Pascal) and snow load (5400 Pascal)